Modular Sensing Assembly for an Electronic Device

ABSTRACT

A modular sensing assembly may be used to detect user inputs at an electronic device. Example user inputs include touch inputs, fingerprint inputs, translational inputs, audio inputs, biometric inputs, and the like. Inputs received using the modular sensing assembly may be used to control a graphical output of a display of the electronic device. A modular sensing assembly may be configured, for example, as a power button, a key of a keyboard, a control button (e.g., volume control), a home button, a watch crown, and so on.

FIELD

Embodiments relate generally to an electronic watch or other electronicdevice. More particularly, the described embodiments relate a modularsensing assembly for receiving multiple types of inputs at an electronicwatch or other electronic device.

BACKGROUND

Many traditional electronic devices include buttons, keys, or othersimilar input mechanisms. Many traditional input mechanisms aredifficult to seal and may introduce one or more paths through whichcontaminants may enter the device. Furthermore, many traditionalmechanisms are structurally integrated in a way that does not facilitatecomponent-level testing or easy repair. The embodiments described hereinare directed to electronic devices having a modular sensing assemblythat may address these and other issues that are associated with sometraditional input mechanisms.

SUMMARY

Embodiments of the systems, devices, methods, and apparatuses describedin the present disclosure are directed to a modular sensing assembly forreceiving multiple types of inputs at an electronic device.

One embodiment may take the form of an electronic watch that includes ahousing defining an interior volume and having a sidewall and a recessformed in the sidewall, a processing unit positioned within the interiorvolume, a display, and a modular sensing assembly disposed in the recessand operably coupled to the processing unit. The modular sensingassembly may include an assembly enclosure that includes a coverdefining a portion of an exterior surface of the electronic watch and atrim member extending around a perimeter of the cover. The modularsensing assembly may further include an electrocardiograph electrodedisposed on the cover and configured to detect an electrocardiographsignal. The modular sensing assembly may further include a sensingsub-assembly positioned between the cover and the sidewall and at leastpartially surrounded by the trim member. The sensing assembly mayinclude a touch sensor configured to detect a touch input on the coverand an audio sensor configured to detect an audio input. The modularsensing assembly may further include a translation sensor positionedbeneath the cover and configured to detect a translational input to thecover and a sealing member positioned between the trim member and thehousing and configured to exclude contaminants from the interior volume.The display may be configured to provide a graphical output that isresponsive to the electrocardiograph signal, the touch input, the audioinput, and the translational input.

Another embodiment may take the form of an electronic watch thatincludes a display, a processing unit operably coupled to the display, ahousing at least partially surrounding the display and having a sidewalland defining a recess formed in the sidewall. The electronic watch mayfurther include a modular sensing assembly disposed in the recess. Themodular sensing assembly may include a cover defining an input surface,a capacitive sensor positioned beneath the input surface and configuredto detect a touch input on the input surface and detect a fingerprintinput on the input surface. The modular sensing assembly may furtherinclude an audio sensor positioned beneath the cover and configured todetect an audio input through an opening in the cover. The modularsensing assembly may further include a translation sensor positionedbeneath the cover and configured to detect a translational input at theinput surface. The modular sensing assembly may further include a trimmember at least partially surrounding the cover, the capacitive sensor,and the audio sensor. The display may be configured to provide agraphical output that is responsive to the touch input, the fingerprintinput, the audio input, and the translational input

Another embodiment may take the form of an electronic device thatinclude a housing defining a recess and a modular sensing assemblydisposed in the recess. The modular sensing assembly may include anassembly enclosure that includes a cover defining an input surface andconfigured to translate in response to a translational input and a trimmember extending around a perimeter of the cover. The modular sensingassembly may further include a touch sensor positioned at leastpartially within the assembly enclosure and configured to detect a touchinput on the input surface and detect a fingerprint input on the inputsurface. The modular sensing assembly may further include an audiosensor positioned at least partially within the assembly enclosure andconfigured to detect an audio input through an opening in the cover. Themodular sensing assembly may further include an electrocardiographelectrode disposed on an exterior surface of the cover and configured todetect an electrocardiograph signal. The modular sensing assembly mayfurther include a dome switch positioned beneath the cover andconfigured to detect the translational input by actuating in response tothe cover translating. The modular sensing assembly may further includea sealing member positioned between the trim member and an insidesurface of the recess, the sealing member configured to deform inresponse to the translational input.

In addition to the example aspects and embodiments described above,further aspects and embodiments will become apparent by reference to thedrawings and by study of the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1A illustrates a block diagram of an example electronic device thatmay incorporate a modular sensing assembly;

FIG. 1B illustrates a block diagram of the example modular sensingassembly of FIG. 1A;

FIGS. 2A-2C illustrate an example electronic watch that includes amodular sensing assembly;

FIGS. 3A-3C illustrate an example electronic watch that includes amodular sensing assembly; and

FIG. 4 illustrates a sample electrical block diagram of an electronicdevice that may incorporate a modular sensing assembly.

The use of cross-hatching or shading in the accompanying figures isgenerally provided to clarify the boundaries between adjacent elementsand also to facilitate legibility of the figures. Accordingly, neitherthe presence nor the absence of cross-hatching or shading conveys orindicates any preference or requirement for particular materials,material properties, element proportions, element dimensions,commonalities of similarly illustrated elements, or any othercharacteristic, attribute, or property for any element illustrated inthe accompanying figures.

Additionally, it should be understood that the proportions anddimensions (either relative or absolute) of the various features andelements (and collections and groupings thereof) and the boundaries,separations, and positional relationships presented therebetween, areprovided in the accompanying figures merely to facilitate anunderstanding of the various embodiments described herein and,accordingly, may not necessarily be presented or illustrated to scale,and are not intended to indicate any preference or requirement for anillustrated embodiment to the exclusion of embodiments described withreference thereto.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following description is not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

The following disclosure relates to a modular sensing assembly for useas part of an electronic device. The modular sensing assembly mayreceive multiple different types of user inputs. Example user inputsinclude touch inputs, fingerprint inputs, translational inputs, audioinputs, biometric inputs, and the like. Inputs received using themodular sensing assembly may be used to control a graphical output of adisplay of the electronic device. A modular sensing assembly may beconfigured, for example, as a power button, a key of a keyboard, acontrol button (e.g., volume control), a home button, a watch crown, andso on.

Combining multiple components in a modular sensing assembly providesadvantages over traditional input mechanisms. Advantages includereducing device component redundancy and manufacturing complexity. Forexample, a modular sensing assembly may include a single sealing memberthat provides a seal around all of the components of the modular sensingassembly and/or between the modular sensing assembly and a devicehousing. This may reduce the overall number of parts required toassemble the electronic device, which may reduce manufacturingcomplexity and cost as well as minimize a size of the device. As anotherexample, multiple components of the modular sensing assembly may beoperably coupled to a processing unit using one or more commonconnectors and/or common passages into an interior volume of the device.

The modular sensing assembly may be positioned at least partially withina housing of an electronic device. Example inputs received by themodular sensing assembly may include touch inputs, translational inputs,fingerprint inputs, audio inputs, electrocardiograph signals, and thelike. The modular sensing assembly may provide one or more outputs.Example outputs provided by the modular sensing assembly include audiooutputs, haptic outputs, visual outputs, and the like.

As discussed in more detail below, the modular sensing assembly mayinclude multiple sensors, sub-assemblies, and/or other componentspositioned within an assembly enclosure. Combining multiple componentsin a modular sensing assembly provides advantages over traditional inputmechanisms. Advantages include reducing device component redundancy andmanufacturing complexity. For example, a modular sensing assembly mayinclude a single sealing member that provides a seal around all of thecomponents of the modular sensing assembly and/or between the modularsensing assembly and a device housing. As another example, multiplecomponents of the modular sensing assembly may be operably coupled to aprocessing unit using one or more common connectors and/or commonpassages into the interior volume of the electronic device.

The modular sensing assemblies described herein may include a sealingmember that inhibits contaminants from entering the interior volumeand/or a housing of the electronic device. “Contaminants,” as usedherein, may be used to refer to foreign matter that is not intended tobe present in the interior volume or the electronic device. Examplecontaminants include liquids, such as water, and solid matter such aslint, dust, and food particles. In one embodiment, a sealing member ispositioned between one or more components of a modular sensing assemblyand one or more surfaces of the housing of the electronic device.

The term “attached,” as used herein, may be used to refer to two or moreelements, structures, objects, components, parts or the like that arephysically affixed, fastened, and/or retained to one another. The term“coupled,” as used herein, may be used to refer to two or more elements,structures, objects, components, parts or the like that are physicallyattached to one another, operate with one another, communicate with oneanother, are in electrical connection with one another, and/or otherwiseinteract with one another. Accordingly, while elements attached to oneanother are coupled to one another, the reverse is not required. As usedherein, “operably coupled” or “electrically coupled” may be used torefer to two or more devices that are coupled in any suitable manner foroperation and/or communication, including wiredly, wirelessly, or somecombination thereof.

These and other embodiments are discussed with reference to FIGS. 1A-4.However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1A illustrates a block diagram of an example electronic device 100that may incorporate a modular sensing assembly 110. The electronicdevice 100 may include a display 122, one or more input devices 124, oneor more output devices 126, and the modular sensing assembly 110. Eachof the components of the electronic device 100 may be operably coupledto a processing unit 128. The electronic device 100 may include ahousing 120. The components of the electronic device 100 may bepositioned at least partially within an interior volume 121 of thehousing 120.

The modular sensing assembly 110 may be positioned at least partiallywithin the housing 120 of the electronic device 100, and may beconfigured to receive inputs and/or provide outputs. Example inputsreceived by the modular sensing assembly 110 may include touch inputs,translational inputs, fingerprint inputs, audio inputs,electrocardiograph signals, and the like. Example outputs provided bythe modular sensing assembly 110 may include audio outputs, hapticoutputs, visual outputs, and the like. The modular sensing assembly 110may be operably coupled to the processing unit 128, for example by aconnector 130 a.

As discussed in more detail below, the modular sensing assembly 110 mayinclude multiple sensors, sub-assemblies, and/or other componentspositioned within an assembly enclosure. Combining multiple componentsin a modular sensing assembly 110 provides advantages over traditionalinput mechanisms. Advantages include reducing device componentredundancy and manufacturing complexity. For example, a modular sensingassembly 110 may include a single sealing member that provides a sealaround all of the components of the modular sensing assembly 110 and/orbetween the modular sensing assembly 110 and the housing 120. As anotherexample, multiple components of the modular sensing assembly 110 may beoperably coupled to the processing unit using one or more commonconnectors and/or common passages into the interior volume 121.

In various embodiments, the display 122 may be positioned at leastpartially within the interior volume 121 of the housing 120. The display122 provides a graphical output, for example associated with anoperating system, user interface, and/or applications of the electronicdevice 100. In one embodiment, the display 122 includes one or moresensors and is configured as a touch-sensitive (e.g., single-touch,multi-touch) and/or force-sensitive display to receive inputs from auser. The display 122 is operably coupled to the processing unit 128 ofthe electronic device 100, for example by a connector 130 b. In somecases, the graphical output of the display 122 is visible along at leasta portion of an external surface of the electronic device 100.

In various embodiments, a graphical output of the display 122 isresponsive to inputs provided at the display, one or more input devices124, and/or one or more modular sensing assemblies 110. For example, theprocessing unit 128 may be configured to modify the graphical output ofthe display 122 in response to determining an electrocardiogram,receiving rotational inputs, receiving translational inputs, receivingtouch inputs, receiving fingerprint inputs, receiving audio inputs, andthe like. In some cases, a haptic output provided by the modular sensingassembly 110 corresponds to the graphical output of the display 122. Insome cases, the modular sensing assembly 110 may produce a haptic outputthat is coordinated with a change in the graphical output of the display122. For example, the haptic output may be produced at or near the sametime as the change in the graphical output of the display 122. In somecases, a time that the haptic output is produced overlaps a time thatthe graphical output of the display 122 changes.

The display 122 can be implemented with any suitable technology,including, but not limited to liquid crystal display (LCD) technology,light emitting diode (LED) technology, organic light-emitting display(OLED) technology, organic electroluminescence (OEL) technology, oranother type of display technology. In some cases, the display 122 ispositioned beneath and viewable through the cover.

Broadly, the input devices 124 may detect various types of input, andthe output devices 126 may provide various types of output. The modularsensing assembly 110 may be an example of an input device 124.Similarly, the modular sensing assembly 110 may be an example of anoutput device 126. The processing unit 128 may be operably coupled tothe input devices 124 and the output devices 126, for example byconnectors 130 c and 130 d, respectively. The processing unit 128 mayreceive input signals from the input devices 124, in response to inputsdetected by the input devices. The processing unit 128 may interpretinput signals received from one or more of the input devices 124 andtransmit output signals to one or more of the output devices 126. Theoutput signals may cause the output devices 126 to provide one or moreoutputs. Detected input at one or more of the input devices 124 may beused to control one or more functions of the electronic device 100.

In some cases, one or more of the output devices 126 may be configuredto provide outputs that are dependent on, or manipulated in response to,the input detected by one or more of the input devices 124. The outputsprovided by one or more of the output devices 126 may also be responsiveto, or initiated by, a program or application executed by the processingunit 128 and/or an associated companion device. Examples of suitableprocessing units, input devices, output devices, and displays, arediscussed in more detail below with respect to FIG. 4.

FIG. 1B illustrates a block diagram of the example modular sensingassembly 110 of FIG. 1A. The modular sensing assembly 110 may include atouch sensor 140, a fingerprint sensor 142, a translation sensor 144, anaudio sensor 146, an electrocardiograph (ECG) electrode 148, and one ormore output devices 149. As noted above, the components of the modularsensing assembly 110 may be positioned at least partially within anassembly enclosure 111.

The touch sensor 140 can be any suitable device for detecting touchinputs the modular sensing assembly 110. As used herein, “touch inputs”may refer to any contact or near-contact with one or more input surfacesof the modular sensing assembly 110 by a user (e.g., a user's finger) oranother object. Touch inputs may be taps, presses, gestures (e.g.,swipes), and the like.

The touch sensor 140 may be implemented as a capacitive sensor, aresistive sensor, a contact sensor, a magnetic sensor, an opticalsensor, an ultrasonic sensor, and so on. The touch sensor 140 mayprovide a signal in response to a touch input that may indicate that thetouch input occurs, a type of input (e.g., tap, press, gesture, etc.),where an input occurs, and/or a measure of the input (e.g., a forcemeasurement). In some cases, the modular sensing assembly 110 includes acover that defines an input surface on an exterior surface of themodular sensing assembly, and the touch sensor 140 may be positionedbeneath the cover of the modular sensing assembly 110 to detect touchinputs on or near the input surface.

Outputs provided by the electronic device 100 may be responsive to touchinputs detected using the touch sensor 140. For example, graphicaloutputs provided by the display 122 and/or audio outputs provided by anaudio output device may be responsive to touch inputs detected using thetouch sensor 140.

The fingerprint sensor 142 can be any suitable device for detectingfingerprint inputs at the modular sensing assembly 110. As used herein,“fingerprint inputs” may refer to any representation of a user'sfingerprint, including a fingerprint image, a fingerprint map, and thelike. Fingerprint inputs may be used by the processing unit 128 toperform authentication operations at the electronic device 100.

The fingerprint sensor 142 may be implemented as a capacitive sensor, aresistive sensor, a contact sensor, a magnetic sensor, an opticalsensor, an ultrasonic sensor, a camera, and so on. The fingerprintsensor 142 may provide a signal in response to a fingerprint input thatmay contain information related to the fingerprint input. In some cases,the fingerprint sensor 142 may be positioned beneath the cover of themodular sensing assembly 110 to detect fingerprint inputs on or near theinput surface. The fingerprint sensor 142 may be an area sensor, meaningthat the fingerprint sensor 142 does not require a swipe of the user'sfinger to capture enough of a fingerprint to uniquely identify the user.The fingerprint sensor 142 may have a sufficiently high resolution suchthat it can be used to uniquely identify an individual using arelatively small section of the user's fingerprint. In some cases, theinput surface has a width between 2 mm and 5 mm, and the fingerprintsensor 142 can still uniquely identify an individual using a fingerprintcaptured at the input surface. In some cases, the fingerprint sensor 142may be a swipe-style fingerprint sensor.

Outputs provided by the electronic device 100 may be responsive tofingerprint inputs detected using the fingerprint sensor 142. Forexample, graphical outputs provided by the display 122 and/or audiooutputs provided by an audio output device may be responsive tofingerprint inputs detected using the fingerprint sensor 142.

The translation sensor 144 can be any suitable device for detectingtranslational inputs at the modular sensing assembly 110. As usedherein, “translational inputs” may refer to inputs to the modularsensing assembly 110 that cause the modular sensing assembly or aportion thereof to move or translate. Translation may include inward andoutward translation, lateral translation, and other movement of one ormore components of the modular sensing assembly 110 (e.g., the cover).For example, the cover of the modular sensing assembly 110 may depressin response to a user pressing on the input surface. The modular sensingassembly 110 or a portion thereof may translate inward in response tothe user pressing on the input surface. The translation sensor 144 maydetect this as a translational input.

The translation sensor 144 may be implemented as a physical switch(e.g., a tactile dome switch), a capacitive sensor, a resistive sensor,a contact sensor, a magnetic sensor, an optical sensor, an ultrasonicsensor, so on. The translation sensor 144 may provide a signal inresponse to a translational input that may indicate that thetranslational input occurs, where an input occurs, and/or a measure ofthe input (e.g., a force measurement). In some cases, the translationsensor 144 may be positioned beneath the cover of the modular sensingassembly 110 to detect translational inputs on or near the inputsurface.

Outputs provided by the electronic device 100 may be responsive totranslational inputs detected using the translation sensor 144. Forexample, graphical outputs provided by the display 122 and/or audiooutputs provided by an audio output device may be responsive totranslational inputs detected using the translation sensor 144.

The audio sensor 146 can be any suitable device for detecting audioinputs at the modular sensing assembly 110. As used herein, “audioinputs” may refer to any detected or measured sounds. For example, theaudio sensor 146 may detect sounds from the environment surrounding theelectronic device 100 for voice commands and other device control,recording, noise-level detection, voice communication (e.g., phonecalls), and the like.

The audio sensor 146 may be implemented as a microphone or any devicefor measuring or detecting audio signals. The audio sensor 146mayprovide a signal corresponding to the audio input to the processing unit128. In some cases, the audio sensor 146 may be positioned beneath thecover of the modular sensing assembly 110 to detect audio inputs throughthe cover and/or through an opening in the cover.

Outputs provided by the electronic device 100 may be responsive to audioinputs detected using the audio sensor 146. For example, graphicaloutputs provided by the display 122 and/or audio outputs provided by anaudio output device may be responsive to audio inputs detected using theaudio sensor 146.

The ECG electrode 148 may be disposed on one or more exterior surfacesof the modular sensing assembly 110. The processing unit 128 or othersensing circuitry of the electronic device 100 may monitor for voltagesor signals received on the ECG electrode 148. The electronic device 100may include one or more additional electrodes positioned on exteriorsurfaces of the electronic device that may be used to provide anelectrocardiogram function for the electronic device.

In some embodiments, the ECG electrode 148 may be disposed (e.g., PVDdeposited) on an exterior surface of the modular sensing assembly 110.The ECG electrode 148 may be positioned on an exterior surface of thecover of the modular sensing assembly 110. The surface may be anytransparent, semi-transparent, translucent, or opaque surface made outof an amorphous solid, glass, a crystal or crystalline material (such assapphire or zirconia), plastic, or the like. The ECG electrode 148 maybe positioned along a portion of the perimeter of a cover of the modularsensing assembly (e.g., a cover that forms an input surface). Theportion of the perimeter of the cover may be curved, and the ECGelectrode 148 may conform to a curvature of the perimeter of the cover.As an example, the portion of the perimeter of the cover along which theECG electrode 148 is placed may define a 180-degree curve. The ECGelectrode 148 may at least partially surround a region of the cover thatdoes not include the ECG electrode. The ECG electrode 148 may have a Cor U shape and may at least partially surround a portion of the coverwhere the ECG electrode is not present. The ECG electrode 148 may extendfrom the exterior surface of the cover, around an edge of the cover, toa connector beneath the cover (e.g., a connector coupled to an interiorsurface of the cover). This may improve the ability of the modularsensing assembly 110 to exclude contaminants by obviating a need to passa connector through a hole in the cover or another component of theelectronic device 100.

Outputs provided by the electronic device 100 may be responsive tosignals received on the ECG electrode 148. For example, graphicaloutputs provided by the display 122 and/or audio outputs provided by anaudio output device may be responsive to signals received on the ECGelectrode 148.

The output device(s) 149 may provide outputs at the modular sensingassembly 110. The output devices 149 may include a haptic output device(e.g., a haptic actuator) for providing haptic outputs, an audio outputdevice (e.g., a speaker) for providing audio outputs, and/or a visualoutput device (e.g., lights) for providing visual outputs.

As used herein, the terms “haptic output” and “tactile output” may referto outputs produced by the electronic device that may be perceivedthrough user touch. Examples of haptic outputs include vibrations,deflections, and other movements of a device housing, a device cover, orinput device, or another device component that forms an input surface ofthe electronic device. In some cases, haptic outputs may providefeedback regarding inputs received at particular locations of theelectronic device. For example, haptic outputs may be provided at themodular sensing assembly 110 to provide feedback related to an inputprovided at the modular sensing assembly. In other cases, haptic outputsmay provide other types of feedback or information to users, such asalerts received at the electronic device.

The modular sensing assembly 110 may include more or fewer componentsthan those shown and described with respect to FIG. 1B. In some cases, asingle device or sub-assembly may provide functionality described withrespect to multiple components above. For example, a single audio devicemay be capable of detecting audio inputs and providing audio inputs. Asanother example, a single sensing device may be capable of detectingtouch inputs and fingerprint inputs. Similarly, a single sensing devicemay be capable of detecting touch inputs and translational inputs.

FIGS. 2A-2C illustrate an example electronic watch 200 that includes amodular sensing assembly 210. The electronic watch 200 may have the sameor similar functionality and structure as the electronic device 100discussed with respect to FIGS. 1A and 1B. Other devices that mayincorporate the modular sensing assemblies described herein includeother wearable electronic devices, other timekeeping devices, otherhealth monitoring or fitness devices, other portable computing devices,mobile phones (including smart phones), tablet computing devices,digital media players, virtual reality devices, audio devices (includingearbuds and headphones), and the like.

As shown in FIG. 2A, the electronic watch 200 may include a watch body220 and a watch band 224. The watch body 220 may include a housing 222.The housing 222 may contain one or more components of the electronicwatch 200 and may define at least part of an external surface of theelectronic watch.

The modular sensing assembly 210 may be positioned in a recess 228 alonga sidewall 222 a of the housing 222. The modular sensing assembly 210may include a cover 212 that defines at least a portion of an inputsurface 214 that forms part of an exterior surface of the electronicwatch 200. The input surface 214 may include multiple regions fordetecting different types of inputs. For example, as shown in FIG. 2A,the input surface 214 may include an ECG region 214 a where ECG signalsmay be detected, a fingerprint-sensing region 214 b where fingerprintinputs may be detected, and an audio sensing region 214 c that includesan opening 216 through which audio signals may be detected. In somecases, the ECG region 214 a, the fingerprint-sensing region 214 b,and/or the audio sensing region 214 c may also be a touch-sensing regionin which touch inputs may be received.

The modular sensing assembly 210 may be capable of receivingtranslational inputs. For example, a user may press inward on the inputsurface 214 to provide a translational input to the modular sensingassembly 210. The cover 212 may translate inward in response to thetranslational input. In some cases, the cover 212 may deflect or bend inresponse to the translational input. In some cases, the cover 212 maynot translate, deflect, or bend in response to a translational input.The modular sensing assembly 210 may include one or more translationsensors to detect the translational inputs.

The ECG region 214 a may include an ECG electrode 218 disposed on anexterior surface of the cover 212. The ECG electrode 218 may beconfigured to detect ECG signals, for example from a user's fingerplaced on the ECG electrode. The ECG signals may be used to provide anelectrocardiogram function for the electronic watch 200. As shown inFIG. 2A, the ECG electrode 218 may be positioned along a portion of theperimeter of the cover 212. The portion of the perimeter of the cover212 may be curved, and the ECG electrode 218 may conform to a curvatureof the perimeter of the cover 212. As an example, the portion of theperimeter of the cover 212 along which the ECG electrode 218 is placedmay define a 180-degree curve as shown in FIG. 2A. The ECG electrode 218may at least partially surround a region of the exterior cover that doesnot include the ECG electrode. For example, as shown in FIG. 2A, the ECGelectrode 218 has a C or U shape and at least partially surrounds aportion of the ECG region 214 a where the ECG electrode is not present.As discussed in more detail below, the ECG electrode 218 may extend fromthe exterior surface of the cover 212, around an edge of the cover, to aconnector beneath the cover (e.g., a connector coupled to an interiorsurface of the cover). This may improve the ability of the modularsensing assembly 210 to exclude contaminants by obviating a need to passa connector through a hole in the cover 212 or another component of theelectronic watch 200.

The ECG electrode 218 may be formed of any suitable material orcombination of materials for receiving ECG signals, including metals andother conductive materials. The cover 212 or one or more portionsthereof may be formed of a non-conductive material to electricallyisolate the ECG electrode 218 from other components of the electronicwatch 200 to reduce interference and signal noise being introduced intothe ECG signals. In some cases, the modular sensing assembly 210 mayinclude an isolating component disposed between the ECG electrode 218and one or more additional components of the modular sensing assembly toreduce interference and signal noise being introduced into the ECGsignals.

The cover 212 may be configured to allow inputs to be detected bycomponents of the modular sensing assembly 210 that are positionedbeneath the cover. The cover 212 may be formed may be formed of orinclude non-conductive and/or dielectric materials that allow sensingsignals, such as capacitive signals, ultrasonic signals, and the like topass through the cover. As an example, the cover 212 may be formed ofsapphire. The cover 212 may be formed of a transparent or translucentmaterial to allow optical sensing signals to pass through the cover. Insome cases, structural features of the cover 212 allow signals to passthrough the cover. For example, the cover may include openings thatallow sensing signals (e.g., optical signals) to pass through the cover.

In some cases, the electronic watch 200 may include a display cover 226facing away from a user's skin as the watch 200 is worn. In some cases,the display cover 226 is mounted to or coupled to the housing 222. Thedisplay cover 226 may be positioned over and protect a display mountedwithin the housing 222 (e.g., display 122 of FIG. 1A). The display maybe viewable by a user through the display cover 226. In some cases, thedisplay cover 226 may be part of a display stack, which may includetouch sensing or force sensing capability. The display may be configuredto depict a graphical output of the electronic watch 200, and a user mayinteract with the graphical output (e.g., using a finger, stylus, orother pointer). As one example, the user may select (or otherwiseinteract with) a graphic, icon, or the like presented on the display bytouching or pressing (e.g., providing touch input) on the display at thelocation of the graphic. In some cases, the haptic outputs provided bythe haptic device correspond to the graphical output of the displayand/or inputs received via the display.

As used herein, the term “display cover” may be used to refer to anytransparent, semi-transparent, or translucent surface made out of glass,a crystalline material (such as sapphire or zirconia), plastic, or thelike. Thus, it should be appreciated that the term “display cover,” asused herein, encompasses amorphous solids as well as crystalline solids.In some examples, the display cover 226 may be a sapphire cover. Thedisplay cover 226 may also be formed of glass, plastic, or othermaterials.

The watch band 224 may be used to secure the electronic watch 200 to auser, another device, a retaining mechanism, and so on. The housing 222may include structures for attaching the watch band 224 to the watchbody 220. In some cases, the structures may include elongate recesses oropenings through which ends of the watch band 224 may be inserted andattached to the watch body 220. In other cases (not shown), thestructures may include indents (e.g., dimples or depressions) in thehousing 222, which indents may receive ends of spring pins that areattached to or threaded through ends of a watch band to attach the watchband to the watch body.

FIG. 2B illustrates a partial exploded view of the example electronicwatch 200. FIG. 2B shows example components of the modular sensingassembly 210 and a cutaway portion of the housing 222. The modularsensing assembly 210 may include a cover sub-assembly 250, a trim member260, a sensing sub-assembly 270, a button sub-assembly 280, translationsensors 292 a, 292 b, and a retention bracket 294. The components of themodular sensing assembly 210 may be coupled together and/or coupled tothe housing 222 using one or more fasteners (e.g., fasteners 296 a, 296b).

The modular sensing assembly 210 may be disposed in a recess along thesidewall 222 a of the housing 222, as described in more detail withrespect to FIG. 2C below. The sidewall 222 a may define one or morepassages 290 a, 290 b that extend through the sidewall and into theinterior volume of the electronic watch 200. The passages 290 a, 290 bmay facilitate attachment of the modular sensing assembly 210 to thehousing 222, as described in more detail with respect to FIG. 2C below.Additionally, the passages 290 a, 290 b may facilitate the transmissionof signals from the modular sensing assembly into the interior volume ofthe electronic watch 200 (e.g., using connectors that operably couplethe components of the modular sensing assembly 210 to a processing unitor other circuitry of the electronic watch 200).

As shown in FIG. 2B, the cover 212 of the modular sensing assembly 210may be part of a cover sub-assembly that includes a membrane 256, theECG electrode 218, and an ECG connector 258. The ECG electrode 218 mayextend from the exterior surface of the cover 212, around an edge of thecover, to the connector 258 beneath the cover. The connector 258 may becoupled to an interior surface of the cover 212, and may extend througha passage 290 a, 290 b into the interior volume of the electronic watch200 (e.g., to a processing unit or other circuitry of the electronicwatch 200). This may give the ECG signal from the ECG electrode 218 aclear signal path to a processing unit while electrically isolating thesignal from the housing and the touch sensor. The ECG electrode 218 andassociated circuitry may be shielded from, operate on a differentfrequency from, or otherwise be configured to reduce parasitic effectswith the touch sensor 272 and/or other components of the modular sensingassembly 210.

The sensing sub-assembly 270 may be positioned beneath the cover 212,and may include a touch sensor 272 and an audio sensor 274. The touchsensor 272 may detect touch inputs on the input surface 214 of the cover212. As discussed above with respect to FIG. 1B, the touch sensor 272may be implemented as a capacitive sensor, a resistive sensor, a contactsensor, a magnetic sensor, an optical sensor, an ultrasonic sensor, andso on. In some cases, the touch sensor 272 is also a fingerprint sensorfor detecting fingerprint inputs on the input surface 214. For example,the touch sensor 272 may be a capacitive sensor configured to detecttouch inputs and fingerprint inputs on the input surface. Thefingerprint sensor may be implemented as a capacitive sensor, aresistive sensor, a contact sensor, a magnetic sensor, an opticalsensor, an ultrasonic sensor, a camera, and so on. In some cases, themodular sensing assembly 210 may include a touch sensor and afingerprint sensor that are separate components.

The audio sensor 274 may be positioned beneath an opening 216 in thecover 212, and may be configured to detect audio inputs. The membrane256 may be positioned beneath the opening 216 in the cover 212 toprevent the ingress of contaminants into the modular button assemblyand/or the interior volume of the electronic watch 200 via the opening216. The membrane may be at least partially transmissive to sound wavesso that the audio sensor 274 can detect audio inputs. The membrane 256may be formed of any suitable material that is at least partiallytransmissive to sound waves and that forms a barrier to excludecontaminants.

The sensing sub-assembly 270 may also include one or more connectors 276that operably couple the touch sensor 272 and the audio sensor 274 to aprocessing unit or other circuitry of the electronic watch 200. Theconnector 276 may extend through a passage 290 a, 290 b into theinterior volume of the electronic watch 200.

The trim member 260 may extend at least partially around a perimeter ofthe cover 212, and may at least partially surround the cover 212, thetouch sensor 272, and the audio sensor 274. As discussed in more detailbelow, the trim member 260 may form part of an assembly enclosure of themodular sensing assembly.

The button sub-assembly 280 may include a sealing member 282, a buttonretainer 284, and a button member 288. The button member 288 may bepositioned within an opening formed by the sealing member 282 and/or thebutton retainer 284. The button retainer 284 may at least partiallysurround the button member 288, and the sealing member 282 may extendaround the button retainer 284. As described in more detail below withrespect to FIG. 2C, the button member 288 may transfer forces applied tothe cover 212 to the translation sensors 292 a, 292 b to recognizetranslational inputs.

The sealing member 282 may be a compressible gasket that forms a sealbetween the housing 222 and the modular sensing assembly 210. Forexample, as shown in FIG. 2C, the sealing member 282 may be positionedalong an inside surface of the recess 228. The sealing member 282 mayextend around one or more passages 290 a, 290 b into the interior volumeto prevent contaminants from entering the interior volume via thepassages. The sealing member 282 may have a shape that allows it tocompress or otherwise deform in response to translation of the cover212, trim member 260, or other components of the modular sensingassembly 210. In some cases, the sealing member 282 is co-molded withthe button retainer 284 to simplify the assembly process of the modularsensing assembly 210.

The translation sensors 292 a, 292 b may be configured as any suitabledevices for detecting translational inputs at the modular sensingassembly 210. Each translation sensor 292 a, 292 b may be implemented asa physical switch (e.g., a tactile dome switch), a capacitive sensor, aresistive sensor, a contact sensor, a magnetic sensor, an opticalsensor, an ultrasonic sensor, so on. The translation sensors 292 a, 292b may provide signals in response to translational inputs that mayindicate that the translational input occurs, where an input occurs,and/or a measure of the input (e.g., a force measurement).

The retention bracket 294 may be positioned along an interior surface ofthe sidewall 222 a. The retention bracket 294, along with fasteners 296a, 296 b may be used to couple together the components of the modularsensing assembly 210. The button retainer 284 may include couplingmechanisms that allow the fasteners to couple the button sub-assembly280 to the retention bracket 294. For example, the button retainer 284may include female threaded connectors 286 a, 286 b configured tointerface with threads of the fasteners 296 a, 296 b.

The retention bracket 294 and the fasteners 296 a, 296 b may be used tosecure the modular sensing assembly 210 to the housing 222. Coupling theretention bracket 294 to the button retainer 284 may secure the modularsensing assembly 210 to the housing 222.

In some cases, the modular sensing assembly 210 may include an assemblyenclosure formed by one or more components. The assembly enclosure mayat least partially surround and/or enclose various components of themodular sensing assembly 210, and allow the modular sensing assembly 210to reduce the number of necessary sealing members. For example, thecomponents of the sensing sub-assembly may be at least partiallysurrounded by the assembly enclosure. The assembly enclosure may beformed by one or more of the cover 212, the trim member 260, the sealingmember 282, the button retainer 284, and the retention bracket 294.

FIG. 2C illustrates a cross-section view of the example electronic watch200 of FIG. 2A, taken through section line A-A. As noted above, themodular sensing assembly 210 may be disposed in a recess 228 along thesidewall 222 a of the housing 222.

The modular sensing assembly 210 may receive translational inputs thatcause the cover 212 to translate or otherwise move. Turning to FIG. 2C,a translational input applied to the input surface 214 may cause thecover 212 to translate downward toward the translation sensor 292 a, 292b. The button member 288 may be positioned between the cover 212 and thetranslation sensors 292 a, 292 b, and may be configured to translate inresponse to a translational input on the input surface that causes thecover 212 to translate. The button member 288 may transfer forcesapplied to the cover 212 to the translation sensors 292 a, 292 b torecognize translational inputs.

Translation of the button member 288 may actuate one or both of thetranslation sensors 292 a, 292 b. In some cases, the button member 288may be moved in a rocking motion to depress one of the translationsensors 292 a, 292 b based on a location of the translational input. Forexample, a translational input on a first region of the cover 212 (e.g.,a left side of the cover with respect to FIG. 2C) may cause a first end(e.g., the left end) of the button member to depress, thereby actuatingthe translation sensor 292 a. Similarly, a translational input on asecond region of the cover 212 (e.g., a right side of the cover withrespect to FIG. 2C) may cause a second end (e.g., the right end) of thebutton member to depress, thereby actuating the translation sensor 292b. The button member 288 may be positioned along a portion 222 b of thehousing or another component of the electronic watch 200 to facilitatethe rocking motion of the button member.

The passages 290 a, 290 b may facilitate attachment of the modularsensing assembly 210 to the housing 222. For example, the retentionbracket 294 may be positioned along an interior surface of the sidewall222 a, and the fasteners 296 a, 296 b may pass through the passages 290a, 290 b and couple the other components of the modular sensing assembly210 to the retention bracket 294. Coupling the components of the modularsensing assembly 210 to the retention bracket 294 may secure the modularsensing assembly 210 to the housing 222.

FIGS. 3A-3C illustrate an example electronic watch 300 that includes amodular sensing assembly 310. The example electronic watch 300 may besimilar to other electronic devices discussed herein (e.g., electronicdevices 100, 200), and may include similar structure and/orfunctionality. As shown in FIG. 3A, the electronic watch 300 may includea modular sensing assembly 310 positioned in a recess 328 a along asidewall 322 a of a housing 322. The modular sensing assembly 310 mayinclude a cover 312 that defines at least a portion of an input surface314 that forms part of an exterior surface of the electronic watch 300.The cover 316 may include an opening, for example for use in detectingaudio inputs.

The electronic watch 300 may include at least one input device orselection device, such as a crown, scroll wheel, knob, dial, button, orthe like, which may be operated by a user of the electronic watch. Theelectronic watch 300 may include a crown 318 positioned along thesidewall 322 a. The crown 318 may be configured to receive rotationalinputs and/or translational inputs. A graphical output of a display ofthe electronic watch 300 may be responsive to inputs received at thecrown 318 and/or the modular sensing assembly 310.

FIG. 3B illustrates a partial exploded view of the example electronicwatch 300. FIG. 3B shows example components of the modular sensingassembly 310 and a cutaway portion of the housing 322. The modularsensing assembly 310 may include a cover sub-assembly 350, a sensingsub-assembly 370, a button sub-assembly 380, a translation sensor 392,and a retention bracket 394. The components of the modular sensingassembly 310 may be coupled together and/or coupled to the housing 322using fasteners 396 a, 396 b and 397 a, 397 b.

The cover sub-assembly may include the cover 312 and a trim member 360.The sensing sub-assembly 370 may include a touch sensor 372, an audiosensor 374, and a connector 376. The button sub-assembly 380 may includea sealing member 382, a button retainer 384, and a button member 388.

The button member 388 may be movably coupled to the housing 322 suchthat the button member 388 may translate in response to a translationalinput to the cover 312. The button member may be aligned with a passage390 c in the sidewall 322 a that is aligned with the translation sensor392. As the button member 388 translates in response to a translationalinput, it may actuate the translation sensor 392. In some cases, thecomponents of the modular sensing assembly 310 do not move in responseto a translational input, and the translation sensor 392 detects a forceapplied to the cover 312.

FIG. 3C illustrates a cross-section view of the example electronic watch300 of FIG. 3A, taken through section line B-B. As noted above, themodular sensing assembly 310 may be disposed in a recess 328 a along thesidewall 322 a of the housing 322.

As shown in FIG. 3C, the cover 312 may include a recessed region 312 athat may guide a user's finger to an appropriate portion of the inputsurface 314 to provide one or more inputs. For example, the recessedregion 312 a may align a user's finger with a fingerprint sensor (e.g.,a fingerprint sensor of the touch sensor 372).

As shown in FIG. 3C, the crown 318 may include that includes a crownbody 318 a and a shaft 318 b. The housing 322 may define a passage 328 bthrough which the shaft extends from an exterior surface of the sidewall322 a and into the interior volume. The crown body 318 a may be attachedand/or coupled to the shaft, and may be accessible to a user exterior tothe housing 322.

The crown body 318 a may be user-rotatable, and may be manipulated(e.g., rotated, pressed) by a user to rotate or translate the shaft 318b. The shaft 318 b may be mechanically, electrically, magnetically,and/or optically coupled to components within the housing 322. A user'smanipulation of the crown body 318 a and shaft 318 b may be used, inturn, to manipulate or select various elements displayed on the display,to adjust a volume of a speaker, to turn the watch 300 on or off, and soon. The crown body 318 a may be operably coupled to a circuit within thehousing 322 (e.g., a processing unit), but electrically isolated fromthe housing 322. The crown 318 may include a conductive electrode usedto measure an ECG or other health-related measurement.

The retention bracket 394 may be positioned along an interior surface ofthe sidewall 322 a. The retention bracket 394, along with fasteners 396a, 396 b may be used to couple together the components of the modularsensing assembly 310. The button retainer 384 may include couplingmechanisms for coupling the button sub-assembly 380 to the retentionbracket 394 using fasteners 396 a, 396 b. For example, the buttonretainer 384 may include female threaded connectors 386 a, 386 bconfigured to interface with threads of the fasteners 396 a, 396 bthrough passages 390 a, 390 e. The button member 388 may includecoupling mechanisms for coupling the button member 388 to the housing322. For example, the button member 388 may include female threadedconnectors 387 a, 387 b configured to interface with threads of thefasteners 397 a, 397 b through passages 390 b, 390 d.

The retention bracket 394 and the fasteners 396 a, 396 b may be used tosecure the modular sensing assembly 310 to the housing 322. Coupling theretention bracket 394 to the button retainer 384 may secure the modularsensing assembly 310 to the housing 322.

FIG. 4 illustrates a sample electrical block diagram of an electronicdevice 400 that may incorporate a modular sensing assembly. Theelectronic device may in some cases take the form of any of theelectronic devices described with reference to FIGS. 1A-3C, or otherportable or wearable electronic devices. The electronic device 400 caninclude a display 412 (e.g., a light-emitting display), a processingunit 402, a power source 414, a memory 404 or storage device, an inputdevice 406 (e.g., a modular sensing assembly), and an output device 410.

The processing unit 402 can control some or all of the operations of theelectronic device 400. The processing unit 402 can communicate, eitherdirectly or indirectly, with some or all of the components of theelectronic device 400. For example, a system bus or other communicationmechanism 416 can provide communication between the processing unit 402,the power source 414, the memory 404, the input device(s) 406, and theoutput device(s) 410.

The processing unit 402 can be implemented as any electronic devicecapable of processing, receiving, or transmitting data or instructions.For example, the processing unit 402 can be a microprocessor, a centralprocessing unit (CPU), an application-specific integrated circuit(ASIC), a digital signal processor (DSP), or combinations of suchdevices. As described herein, the term “processing unit” is meant toencompass a single processor or processing unit, multiple processors,multiple processing units, or other suitably configured computingelement or elements.

It should be noted that the components of the electronic device 400 canbe controlled by multiple processing units. For example, selectcomponents of the electronic device 400 (e.g., an input device 406) maybe controlled by a first processing unit and other components of theelectronic device 400 (e.g., the display 412) may be controlled by asecond processing unit, where the first and second processing units mayor may not be in communication with each other. In some cases, theprocessing unit 402 may determine a biological parameter of a user ofthe electronic device, such as an ECG for the user.

The power source 414 can be implemented with any device capable ofproviding energy to the electronic device 400. For example, the powersource 414 may be one or more batteries or rechargeable batteries.Additionally or alternatively, the power source 414 can be a powerconnector or power cord that connects the electronic device 400 toanother power source, such as a wall outlet.

The memory 404 can store electronic data that can be used by theelectronic device 400. For example, the memory 404 can store electricaldata or content such as, for example, audio and video files, documentsand applications, device settings and user preferences, timing signals,control signals, and data structures or databases. The memory 404 can beconfigured as any type of memory. By way of example only, the memory 404can be implemented as random access memory, read-only memory, Flashmemory, removable memory, other types of storage elements, orcombinations of such devices.

In various embodiments, the display 412 provides a graphical output, forexample associated with an operating system, user interface, and/orapplications of the electronic device 400. In one embodiment, thedisplay 412 includes one or more sensors and is configured as atouch-sensitive (e.g., single-touch, multi-touch) and/or force-sensitivedisplay to receive inputs from a user. For example, the display 412 maybe integrated with a touch sensor (e.g., a capacitive touch sensor)and/or a force sensor to provide a touch- and/or force-sensitivedisplay. The display 412 is operably coupled to the processing unit 402of the electronic device 400.

The display 412 can be implemented with any suitable technology,including, but not limited to liquid crystal display (LCD) technology,light emitting diode (LED) technology, organic light-emitting display(OLED) technology, organic electroluminescence (OEL) technology, oranother type of display technology. In some cases, the display 412 ispositioned beneath and viewable through a cover that forms at least aportion of an enclosure of the electronic device 400.

In various embodiments, the input devices 406 may include any suitablecomponents for detecting inputs. Examples of input devices 406 includeaudio sensors (e.g., microphones), optical or visual sensors (e.g.,cameras, visible light sensors, or invisible light sensors), proximitysensors, touch sensors, force sensors, mechanical devices (e.g., crowns,switches, buttons, or keys), vibration sensors, orientation sensors,motion sensors (e.g., accelerometers or velocity sensors), locationsensors (e.g., global positioning system (GPS) devices), thermalsensors, communication devices (e.g., wired or wireless communicationdevices), resistive sensors, magnetic sensors, electroactive polymers(EAPs), strain gauges, electrodes, and so on, or some combinationthereof. Each input device 406 may be configured to detect one or moreparticular types of input and provide a signal (e.g., an input signal)corresponding to the detected input. The signal may be provided, forexample, to the processing unit 402.

As discussed above, in some cases, the input device(s) 406 include atouch sensor (e.g., a capacitive touch sensor) integrated with thedisplay 412 to provide a touch-sensitive display. Similarly, in somecases, the input device(s) 406 include a force sensor (e.g., acapacitive force sensor) integrated with the display 412 to provide aforce-sensitive display.

The output devices 410 may include any suitable components for providingoutputs. Examples of output devices 410 include audio output devices(e.g., speakers), visual output devices (e.g., lights or displays),tactile output devices (e.g., haptic output devices), communicationdevices (e.g., wired or wireless communication devices), and so on, orsome combination thereof. Each output device 410 may be configured toreceive one or more signals (e.g., an output signal provided by theprocessing unit 402) and provide an output corresponding to the signal.

In some cases, input devices 406 and output devices 410 are implementedtogether as a single device. For example, an input/output device or portcan transmit electronic signals via a communications network, such as awireless and/or wired network connection. Examples of wireless and wirednetwork connections include, but are not limited to, cellular, Wi-Fi,Bluetooth, IR, and Ethernet connections.

The processing unit 402 may be operably coupled to the input devices 406and the output devices 410. The processing unit 402 may be adapted toexchange signals with the input devices 406 and the output devices 410.For example, the processing unit 402 may receive an input signal from aninput device 406 that corresponds to an input detected by the inputdevice 406. The processing unit 402 may interpret the received inputsignal to determine whether to provide and/or change one or more outputsin response to the input signal. The processing unit 402 may then sendan output signal to one or more of the output devices 410, to provideand/or change outputs as appropriate.

The foregoing description, for purposes of explanation, uses specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic watch comprising: a housingdefining an interior volume and having a sidewall and a recess formed inthe sidewall; a processing unit positioned within the interior volume; adisplay operably coupled to the processing unit; a modular sensingassembly disposed in the recess and operably coupled to the processingunit, the modular sensing assembly comprising: an assembly enclosurecomprising: a cover defining a portion of an exterior surface of theelectronic watch; and a trim member extending around a perimeter of thecover; an electrocardiograph electrode disposed on the cover andconfigured to detect an electrocardiograph signal; a sensingsub-assembly positioned between the cover and the sidewall and at leastpartially surrounded by the trim member, the sensing sub-assemblycomprising: a touch sensor configured to detect a touch input on thecover; an audio sensor configured to detect an audio input; atranslation sensor positioned beneath the cover and configured to detecta translational input to the cover; and a sealing member positionedbetween the trim member and the housing and configured to excludecontaminants from the interior volume; wherein: the display isconfigured to provide a graphical output that is responsive to theelectrocardiograph signal, the touch input, the audio input, and thetranslational input.
 2. The electronic watch of claim 1, wherein: thesidewall further defines a passage that extends through the sidewall tothe interior volume; the modular sensing assembly further comprises: aretention bracket positioned along an interior surface of the sidewall;a button member positioned beneath the cover and configured to depressin response to the translational input, thereby actuating thetranslation sensor; a button retainer at least partially surrounding thebutton member and coupled to the retention bracket via a fastener thatextends through the passage; and the sealing member extends around thebutton retainer.
 3. The electronic watch of claim 2, wherein: thetranslation sensor is a first translation sensor positioned beneath afirst end of the button member; the modular sensing assembly furthercomprises a second translation sensor positioned beneath a second end ofthe button member; a first translational input on a first region of thecover causes the first end of the button member to depress, therebyactuating the first translation sensor; and a second translational inputon a second region of the cover causes the second end of the buttonmember to depress, thereby actuating the second translation sensor. 4.The electronic watch of claim 3, wherein: the passage is a firstpassage; the sidewall further defines a second passage that extendsthrough the sidewall to the interior volume; the first translationsensor is positioned at least partially within the first passage; andthe second translation sensor is positioned at least partially withinthe second passage.
 5. The electronic watch of claim 1, wherein thetouch sensor is a capacitive touch sensor and is further configured todetect a fingerprint input.
 6. The electronic watch of claim 1, whereinthe cover comprises sapphire.
 7. The electronic watch of claim 1,wherein: the cover defines an opening extending through the cover; theaudio sensor is positioned beneath the opening and configured to detectthe audio input through the opening.
 8. The electronic watch of claim 7,wherein the electronic watch further comprises a membrane positionedbeneath the opening and configured to prevent contaminants from passingthrough the opening.
 9. An electronic watch comprising: a display; aprocessing unit operably coupled to the display; a housing at leastpartially surrounding the display, the housing having a sidewall anddefining a recess formed in the sidewall; and a modular sensing assemblydisposed in the recess, and comprising: a cover defining an inputsurface; a capacitive sensor positioned beneath the input surface andconfigured to: detect a touch input on the input surface; and detect afingerprint input on the input surface; an audio sensor positionedbeneath the cover and configured to detect an audio input through anopening in the cover; a translation sensor positioned beneath the coverand configured to detect a translational input at the input surface; anda trim member at least partially surrounding the cover, the capacitivesensor, and the audio sensor; wherein: the display is configured toprovide a graphical output that is responsive to the touch input, thefingerprint input, the audio input, and the translational input.
 10. Theelectronic watch of claim 9, wherein: the electronic watch furthercomprises a crown positioned along the sidewall and configured toreceive a rotational input; and the graphical output is furtherresponsive to the rotational input.
 11. The electronic watch of claim10, wherein: the sidewall further defines: a first passage extendingfrom the recess into an interior volume of the housing; and a secondpassage extending from an exterior surface of the sidewall into theinterior volume of the housing; the modular sensing assembly furthercomprises: a retention bracket positioned along an interior surface ofthe sidewall; a button member positioned between the cover and thetranslation sensor and extending at least partially through the firstpassage; and the crown includes a shaft extending through the secondpassage.
 12. The electronic watch of claim 11, wherein: the translationsensor is coupled to the retention bracket and aligned with the firstpassage; and the button member is configured to translate in response tothe cover translating, thereby actuating the translation sensor.
 13. Theelectronic watch of claim 11, wherein the modular sensing assemblyfurther comprises a sealing member positioned along an inside surface ofthe recess and configured to deform in response to the covertranslating.
 14. The electronic watch of claim 13, wherein: the sidewallfurther defines a third passage extending from the recess into theinterior volume of the housing; the modular sensing assembly furthercomprises a button retainer extending around the button member andcoupled to the retention bracket via a fastener extending through thethird passage; and the sealing member extends around the button retainerand forms a seal between the button retainer and the housing.
 15. Theelectronic watch of claim 13, wherein: the sidewall further defines athird passage extending from the recess into the interior volume of thehousing; the modular sensing assembly further comprises a connector thatoperably couples the capacitive sensor to the processing unit andextends through the third passage and into the interior volume; and thesealing member extends around the first passage and the third passageand is configured to prevent contaminants from entering the interiorvolume via the first passage or the third passage.
 16. An electronicdevice comprising: a housing defining a recess; a modular sensingassembly disposed in the recess, and comprising: an assembly enclosurecomprising: a cover defining an input surface and configured totranslate in response to a translational input; and a trim memberextending around a perimeter of the cover; a touch sensor positioned atleast partially within the assembly enclosure and configured to: detecta touch input on the input surface; and detect a fingerprint input onthe input surface; an audio sensor positioned at least partially withinthe assembly enclosure and configured to detect an audio input throughan opening in the cover; an electrocardiograph electrode disposed on anexterior surface of the cover and configured to detect anelectrocardiograph signal; a dome switch positioned beneath the coverand configured to detect the translational input by actuating inresponse to the cover translating; and a sealing member positionedbetween the trim member and an inside surface of the recess, the sealingmember configured to deform in response to the translational input. 17.The electronic device of claim 16, wherein the electrocardiographelectrode is positioned along a portion of the perimeter of the cover.18. The electronic device of claim 17, wherein: the portion of theperimeter of the cover is curved; the electrocardiograph electrodeconforms to a curvature of the portion of the perimeter of the cover;and the electrocardiograph electrode at least partially surrounds aregion of the cover that does not include the electrocardiographelectrode.
 19. The electronic device of claim 18, wherein the portion ofthe perimeter of the cover defines a 180-degree curve.
 20. Theelectronic device of claim 16, wherein the electrocardiograph electrodeextends from the exterior surface of the cover and around an edge of thecover to a connector coupled to an interior surface of the cover.